Taking the heat out of the liquid cooling debate

Adam Raymond, Sales Manager UK & Ireland at SWEP International, discusses the increasing pressures on data centre cooling thanks to the AI explosion, explaining how liquid cooling solutions - rear door heat exchangers, direct to chip and immersion technologies - will play an increasingly important role in a likely hybrid cooling future. Adam also explains the role that SWEP’s heat transfer expertise and Brazed Plate Heat Exchanger (BPHE) technology have to play in this rapidly evolving data centre landscape - where the heat recovery possibilities are also being explored.
Noam Brousard, Vice President, Solutions Engineering, proteanTecs, explains how semiconductors are...
Ben Pritchard, AVK CEO, discusses the findings of a joint Wartsila and AVK-SEG white paper: Data...
Johan van Hover, Business Manager at Arteco Coolants, outlines the company’s history as a joint...
Dr Poh Seng (PS) Lee, Professor and Head of Mechanical Engineering at the National University of...
David Rimmer, Microgrid Business Leader UK&I at Schneider Electric, outlines the ways in which data...
Ciaran Flanagan, Global Head of Data Center Solutions at Siemens, explains the decision for Siemens...
In this video, we talk to RiT Tech at the DCA's 10x10 2025
In this video, we talk to FlaktGroup at the DCA's 10x10 2025.