Frore Systems unveils AirJet Mini G2

Frore Systems has unveiled its AirJet Mini G2 at CES, showcasing their latest development in compact thermal cooling technology. Displayed in various partner systems, including the Qualcomm Snapdragon X2 Elite 2-in-1 notebook, the AirJet Mini G2 marks a development in thermal management.

First introduced at COMPUTEX 2025, this cooling chip has moved from an emerging technology to a deployable platform, supporting the rollout of AI in compact, fanless devices.

The AirJet Mini G2 received its third consecutive CES Innovation Award, reflecting industry recognition of its contribution to AI system development.

Building on existing AirJet Mini designs, which have already been commercially deployed, the AirJet Mini G2 has facilitated the launch of the AT&T Sonim MegaConnect, aiming to enhance performance, compactness, and reliability for first responders through its reduced reliance on bulky thermal solutions.

This approach is designed to support sustained high-power output in designs that are dust-proof, water-resistant, and suitable for rugged environments where performance consistency is critical.

Aligning With Future AI Needs

• The AirJet Mini G2 is designed to increase heat removal efficiency by 50% compared to its predecessor, supporting sustained computing performance in compact devices.
  
• The technology aligns with Frore's Law of doubling thermal efficiency, helping AI advancement avoid throttling due to thermal constraints.
  

At CES, Frore has demonstrated the versatility of the AirJet Mini G2 through a range of applications, supporting Qualcomm notebooks and Mini-PC reference designs in sustaining performance in sleek, ultra-thin structures.

Technical Insights

• Heat Dissipation: Up to 7.5W, reducing the need for additional cooling aids.
• Compact Dimensions: At 2.65 mm thickness, it provides silence and reliability in operation.
• Noiseless Operation: Generating only 21 dBA, it embraces a noise-free cooling experience.

The AirJet Mini G2's design, comprising no moving parts, enables cooling through high-velocity air jets, helping edge AI devices meet the demanding expectations for performance, compactness, and durability.

Supported devices range from laptops, tablets, and PCs to IOT devices driving sectors such as data centres, automotive, and defence.