Sylvie Gellida, General Manager, Optical and RF Foundry Division, STMicroelectronics, discusses the implications of the company entering high-volume production of its PIC100 silicon photonics platform to support AI infrastructure demand. With plans to quadruple capacity by 2027, further expand in 2028 and with PIC100 through-silicon via (TSV) on ST’s technology roadmap, the company is delivering the benefits of higher bandwidth, lower latency, and greater energy efficiency as AI workloads...
Read More
Tim Collier, director and UK data centre lead at Turner & Townsend, explains what’s needed to build confidence in the industry and to deliver data centres on schedule, how to navigate heightened competition for power and skills, and what the company’s latest Data Centre Construction Cost Index – which analyses costs and trends in 52 data centre markets worldwide – reveals for emerging solutions for improving productivity and the complexities of building especially AI data centres.
Read More