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NEWS
Building the future, facing the neighbours: gigawatt data centres in 2026 

As AI leads to bigger data centres, power grids and public perceptions may shape what’s actually possible.   By Tate Cantrell, Verne CTO.

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NEWS
2026’s Perfect Storm: AI Growth vs. Power Availability

TES Power’s Managing Director, Michael Beagan explores the top five power challenges the data...

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NEWS
How large motors and generators enable stable, scalable data centers

By Luca Rizzo, Segment Manager at ABB Motion High Power.

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The future of AI depends on data centre efficiency

By Sadiq Syed, SVP Digital Buildings, Schneider Electric.

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NEWS
The Data Centre Challenge: Powering up sustainable data storage

By Andrew Dodd, HPE Storage Worldwide Marketing Communications Manager, the LTO Program.

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NEWS
Higher loads, faster builds: six trends defining data centres in 2026

This article was developed jointly by engineers from Black & White Engineering’s global offices,...

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NEWS
The Greening of the Internet Exchange Point

By Jennifer Holmes, CEO of the London Internet Exchange (LINX).

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Videos

In this interview, Doni Brass, VP of Products at Guardz, breaks down how Guardz is helping MSPs fight back against increasingly accessible cybercrime with automation, unified tools, and AI-powered triage. He...
Data Centre World 2026
Nancy Hammervik, Chief Channel Officer at GTIA, shares insights from 40 years in the tech channel. She explains how community, mentorship, and a “member-first” mindset drive real impact in the industry....
Data Centre World 2026

News

Sectigo reveals multi-tenant partner platform, aiming for seamless, automated certificate management for channel partners.
AI adoption is increasing across organisations, despite ongoing concerns around security, governance, and compliance.
Corning partners with US Conec to enhance AI network connectivity through PRIZM TMT technology, facilitating higher fibre densities in data centres.
OptiCool Technologies has partnered with CoreSite to support cooling solutions in high-density data centres, addressing thermal constraints and power density requirements.