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Accelsius, renowned for its advanced data center cooling innovations, has announced a strategic deployment of its NeuCool™ IR80 system. This deployment will occur in Q3 2025 at Equinix's Co-Innovation Facility (CIF), located within the DC15 International Business Exchange™ (IBX®) data center at the Equinix Ashburn Campus.
The CIF provides an unparalleled platform for Equinix to collaborate with pioneering companies like Accelsius, enabling customers to witness these cutting-edge solutions firsthand.
“This kind of collaboration is a powerful way to demonstrate our technology in real-world scenarios,” noted Josh Claman, CEO of Accelsius. “The key thing we’ve found is making it tangible for our customers, helping them see and visualize its functionality in their context.”
Equinix's Innovation Director, Global Design & Construction, Pawel Wlodarczak, further emphasizes the potential: “Liquid cooling is revolutionizing how data centers manage powerful, high-density equipment. Collaborating with Accelsius in our Co-Innovation Facility facilitates our continuous innovation on high-density cooling solutions, an essential component for data centers.”
The innovative NeuCool™ IR80 system by Accelsius operates on a two-phase, direct-to-chip solution, which allows for 6–8°C warmer inlet water temperatures compared to alternative technologies. This approach significantly enhances free cooling capabilities and reduces dependency on energy-intensive compressors.
This strategic collaboration underscores the commitment of both companies to enhance energy efficiency, a mission propelled by their engagement in ARPA-E's COOLERCHIPS program. The program aims to minimize total cooling energy consumption to below 5% of a data center’s IT load.
Accelsius anticipates that this revolutionary deployment will highlight the benefits of two-phase, direct-to-chip cooling, particularly for safeguarding critical computational assets like GPUs. Unlike traditional single-phase systems, the dielectric fluid used in Accelsius' technology is non-conductive, preventing electronic damage even in scarce leak scenarios.
